Ziduo Su

Deep Dry Etching of Silicon with Scallop Size Uniformly Larger than 300 nm

Yuanwei Lin, Renzhi Yuan, Xinshuai Zhang et al. · Silicon · 2018 · 20 citations

Engineering, Materials Engineering, Materials Science +12

Uniformity improvement of deep silicon cavities fabricated by plasma etching with 12-inch wafer level

Yongqin Cui, Shijie Jian, Cheng Chen et al. · Journal of Micromechanics and Microengineering · 2019 · 19 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +14

The application of the scallop nanostructure in deep silicon etching

Yuanwei Lin, Renzhi Yuan, Ce Zhou et al. · Nanotechnology · 2020 · 16 citations

Engineering, Electrical Engineering, Materials Science +17