Yong Xiao

Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications

Mingyu Li, Yong Xiao, Zhihao Zhang et al. · ACS Applied Materials & Interfaces · 2015 · 203 citations

Natural Sciences, Materials Engineering, Materials Science +17

Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature

Mingyu Li, Zhuolin Li, Yong Xiao et al. · Applied Physics Letters · 2013 · 82 citations

Natural Sciences, Materials Engineering, Materials Science +15

Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves

Zhuolin Li, Mingyu Li, Yong Xiao et al. · Ultrasonics Sonochemistry · 2013 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

He Huang, Shangyu Huang, Yongchao Ye et al. · Journal of Alloys and Compounds · 2020 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +16

Large-scale current collectors for regulating heat transfer and enhancing battery safety

Lun Li, Jinlong Yang, Rui Tan et al. · Nature Chemical Engineering · 2024 · 53 citations · Full text

Engineering, Electrical Engineering, Mechanical Engineering +16