Hai‐Young Lee - Concepedia

Author

Hai‐Young Lee

Also Known As

HAIYOUNG LEE, Hai-Young Lee, Hai-young Lee, Haiyoung Lee, Hai‐Young Lee, The Korean Society of Bilingualism, The Korean Society of Culture and Convergence, 이화여자대학교

155

Publications

914

Citations

H-Index

Concepts

All Affiliations

Ajou University Samsung (South Korea)

About

Hai‐Young Lee is an author at Ajou University specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	20	699
2	Electrical Engineering	14	15	582
3	Applied Physics	5	5	198
4	Computer Engineering	4	4	109
5	Physics	3	3	79

Hai‐Young Lee

Publications

727

Citations

H-Index

Page 1

	Year	Citations
Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider Dong‐Sik Eom, Jindo Byun, Hai‐Young Lee IEEE Transactions on Microwave Theory and Techniques Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Interconnect (Integrated Circuits)Four-way Power Division	2009	111
Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits Hai‐Young Lee IEEE Transactions on Microwave Theory and Techniques EngineeringBonding WireMicrowave TransmissionIntegrated CircuitsInductance Increase	1995	105
An Ultra Low-Power CMOS Transceiver Using Various Low-Power Techniques for LR-WPAN Applications Yong-Il Kwon, Sang‐Gyu Park, Ta-Joon Park, IEEE Transactions on Circuits and Systems I Regular Papers Wireless CommunicationsCrystal OscillatorEngineeringRadio FrequencyMicrowave Transmission	2011	64
Ultra-Wideband CPW-to-Substrate Integrated Waveguide Transition Using an Elevated-CPW Section Sunho Lee, Sang-Woon Jung, Hai‐Young Lee IEEE Microwave and Wireless Components Letters Electrical EngineeringMillimeter Wave TechnologyEngineeringAntennaCoplanar Waveguide	2008	56
A $S$-Bridged Inductive Electromagnetic Bandgap Power Plane for Suppression of Ground Bounce Noise Sung‐Ho Joo, Dong-Yeop Kim, Hai‐Young Lee IEEE Microwave and Wireless Components Letters Electrical EngineeringGround Bounce NoiseEngineeringRadio FrequencyHigh-frequency Device	2007	50
Wideband and compact bandstop filter structure using double-plane superposition Jin-Yang Kim, Hai‐Young Lee IEEE Microwave and Wireless Components Letters PhotonicsEngineeringFilter BankFilter (Signal Processing)Double-plane Superposition	2003	48
Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging Sang-Ki Yun, Hai‐Young Lee IEEE Microwave and Guided Wave Letters EngineeringParasitic Impedance AnalysisInterconnect (Integrated Circuits)Electromagnetic CompatibilityAdvanced Packaging (Semiconductors)	1995	34
Suppression of leakage resonance in coplanar MMIC packages using a Si sub-mount layer Sung-Jin Kim, Ho-Sung Yeon, Hai‐Young Lee IEEE Transactions on Microwave Theory and Techniques EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityRf Semiconductor	2000	30
Folded Corrugated SIW (FCSIW) Slot Antenna for Backlobe Suppression Dae-Keun Cho, Hai‐Young Lee IEEE Antennas and Wireless Propagation Letters EngineeringFolded StubsRadio FrequencyAntennaMicrowave Antenna	2013	25
Novel high-Q bondwire inductor for MMIC Yong-Goo Lee, Sang-Ki Yun, Hai‐Young Lee Electrical EngineeringEngineeringRf SemiconductorNh InductanceHigh-frequency Device	2002	25

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