Concepedia

Yasuhiro Yoneshima

YY

Statistics

Publications

2

Citations

32

H-Index

2

Active since

2013

Affiliations

The University of Osaka(Current)

Yasuhiro Yoneshima is an author at The University of Osaka specializing in wafer bonding, metallic materials, and materials science.

Publications per year

2013–2017

2

Publications

2

Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding

Masakatsu Maeda, Yasuhiro Yoneshima, Hideki Kitamura et al. · MATERIALS TRANSACTIONS · 2013 · 18 citations · Full text

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Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Yasuo Takahashi, Hiroki Fukuda, Yasuhiro Yoneshima et al. · Journal of Electronic Packaging · 2017 · 14 citations

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