Steven M. Ford is an author at Intel (United States) specializing in microelectronics, 3d printing, and mechanical engineering.
Top concepts
3D PrintingEngineeringSolid MechanicsMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingFlexible ElectronicsElectrical InsulationElectrical Engineering
Publications per year
2006–2006
1
1
High-Density Compliant Die-Package Interconnects
Sriram Muthukumar, Charles D. Hill, Steven M. Ford et al. · 2006 · 19 citations
Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +17
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