Ahmed Hassona - Concepedia

Author

Ahmed Hassona

Chalmers University of Technology ORCID

Also Known As

A. Hassona, Ahmed Hassona, Hassona, Ahmed

Publications

205

Citations

H-Index

Concepts

All Affiliations

Chalmers University of Technology Ericsson (Sweden)Infineon Technologies (Austria)KTH Royal Institute of Technology

About

Ahmed Hassona is an author at Chalmers University of Technology specializing in engineering, antenna, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	158
2	Electrical Engineering	6	6	130
3	Computer Engineering	3	3	54
4	Applied Physics	2	2	59
5	Advanced Packaging	1	1	17

Ahmed Hassona

Publications

158

Citations

H-Index

Page 1

	Year	Citations
Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems James Campion, Yinggang Li, Herbert Zirath, IEEE Transactions on Terahertz Science and Technology Thz PhotonicsTerahertz TechnologyEngineeringOscillatorsMicrowave Transmission	2019	47
Spectrum Efficient D-band Communication Link for Real-time Multi-gigabit Wireless Transmission Vessen Vassilev, Mikael Hörberg, Yinggang Li, Single Monolithic MicrowaveEngineeringFull DuplexRadio FrequencyMicrowave Transmission	2018	28
Silicon Taper Based $D$ -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems Ahmed Hassona, Vessen Vassilev, Zhongxia Simon He, IEEE Microwave and Wireless Components Letters EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityAdvanced Packaging (Semiconductors)	2017	21
Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures Ahmed Hassona, Vessen Vassilev, Ashraf Uz Zaman, IEEE Microwave and Wireless Components Letters Terahertz TechnologyEngineeringPeriodic Electromagnetic BandgapIntegrated CircuitsInterconnect (Integrated Circuits)	2020	19
Nongalvanic Generic Packaging Solution Demonstrated in a Fully Integrated <i>D</i>-Band Receiver Ahmed Hassona, Vessen Vassilev, Ashraf Uz Zaman, IEEE Transactions on Terahertz Science and Technology EngineeringRadio FrequencyIntegrated CircuitsElectromagnetic CompatibilityAdvanced Packaging (Semiconductors)	2020	17
Demonstration of +100-GHz Interconnects in eWLB Packaging Technology Ahmed Hassona, Zhongxia Simon He, Vessen Vassilev, IEEE Transactions on Components Packaging and Manufacturing Technology Electrical EngineeringEwlb Packaging TechnologyEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2019	14
A non-galvanic D-band MMIC-to-waveguide transition using eWLB packaging technology Ahmed Hassona, Zhongxia Simon He, Chiara Mariotti, EngineeringElectromagnetic CompatibilityEwlb Packaging TechnologyAdvanced Packaging (Semiconductors)Guided-wave Optic	2017	12

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