Concepedia
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Publications
1
Citations
14
H-Index
Active since
2002
R. Wojnarowski is an author specializing in embedded die packaging, materials engineering, and yielding behavior.
Publications per year
2002–2002
Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics
R. Fillion, R. Wojnarowski, T. Gorcyzca et al. · 2002 · 14 citations
Engineering, Materials Engineering, Materials Science +17
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