Concepedia

Pay Jun Liew

PJ

Statistics

Publications

13

Citations

598

H-Index

11

Active since

2013

Affiliations

Technical University of Malaysia Malacca(Current)

Keio University

Dalian Maritime University

Tohoku University

Pay Jun Liew is an author at Technical University of Malaysia Malacca specializing in materials engineering, engineering, and materials science.

Publications per year

2013–2022

13

Publications

13

An overview of current status of cutting fluids and cooling techniques of turning hard steel

Pay Jun Liew, Ainusyafiqah Shaaroni, Nor Azwadi Che Sidik et al. · International Journal of Heat and Mass Transfer · 2017 · 171 citations

Engineering, Manufacturing Engineering, Materials Engineering +13

Fabrication of deep micro-holes in reaction-bonded SiC by ultrasonic cavitation assisted micro-EDM

Pay Jun Liew, Jiwang Yan, Tsunemoto Kuriyagawa · International Journal of Machine Tools and Manufacture · 2013 · 140 citations

Engineering, Materials Engineering, Materials Science +16

Carbon nanofiber assisted micro electro discharge machining of reaction-bonded silicon carbide

Pay Jun Liew, Jiwang Yan, Tsunemoto Kuriyagawa · Journal of Materials Processing Technology · 2013 · 76 citations

Engineering, Materials Engineering, Materials Science +16

Experimental investigation on material migration phenomena in micro-EDM of reaction-bonded silicon carbide

Pay Jun Liew, Jiwang Yan, Tsunemoto Kuriyagawa · Applied Surface Science · 2013 · 51 citations

Engineering, Materials Engineering, Materials Science +10

Material Removal in Ultrasonic Abrasive Polishing of Additive Manufactured Components

Jingsi Wang, Jiaqi Zhu, Pay Jun Liew · Applied Sciences · 2019 · 42 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +16

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