Teck Joo Goh

Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes

L.C. Sim, Sutapa Roy Ramanan, H. Ismail et al. · Thermochimica Acta · 2005 · 485 citations

Engineering, Materials Engineering, Materials Science +17

Thermal methodology for evaluating the performance of microelectronic devices with non-uniform power dissipation

Teck Joo Goh · 2003 · 12 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermal investigations of microelectronic chip with non‐uniform power distribution: temperature prediction and thermal placement design optimization

Teck Joo Goh, K. N. Seetharamu, G.A. Quadir et al. · Microelectronics International · 2004 · 11 citations

Engineering, Computational Engineering, Electrical Engineering +17

Parametric finite element analysis of solder joint reliability of flip chip on board

Teck Joo Goh · 2002 · 10 citations

Engineering, Materials Engineering, Materials Science +13

Optimization of fins used in electronic packaging

Kang Eu Ong, Kor Oon Lee, K. N. Seetharamu et al. · Microelectronics International · 2005 · 10 citations

Engineering, Mechanical Engineering, Design Optimization +16