Silvio Dalla Piazza

Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2013 · 27 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks

David Ruffieux, Nicola Scolari, Frédéric Giroud et al. · IEEE Journal of Solid-State Circuits · 2013 · 20 citations

Engineering, Electrical Engineering, Microelectronics +14

Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices

Kai Zoschke, Charles-Alix Manier, Martin Wilke et al. · 2015 · 17 citations

Engineering, Materials Science, Microelectromechanical Systems +16

11.5 A 3.2×1.5×0.8mm3 240nA 1.25-to-5.5V 32kHz-DTCXO RTC module with an overall accuracy of µ1ppm and an all-digital 0.1ppm compensation-resolution scheme at 1Hz

David Ruffieux, F. Pengg, Nicola Scolari et al. · 2016 · 14 citations

Engineering, Computer Engineering, Electrical Engineering +17

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Charles-Alix Manier, Kai Zoschke, Martin Wilke et al. · 2016 · 10 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16