Concepedia

Yen‐Ming Tseng

YT

9

Publications

204

Citations

9

H-Index

2012

Active since

Affiliations

University of Akron(Current)

United States Food and Drug Administration

Center for Devices and Radiological Health

Office of Science

Yen‐Ming Tseng is an author at University of Akron specializing in engineering, 3d printing, and 3d bioprinting.

Top concepts

Engineering3D Printing3D BioprintingPolymer ScienceMaterial ScienceBiomedical EngineeringDesignAntennaMedicineRheology

Publications per year

2012–2024

9

Publications

9

Multiphasic Coacervates Assembled by Hydrogen Bonding and Hydrophobic Interactions

Xinhao Liu, Abdol Hadi Mokarizadeh, Amal Narayanan et al. · Journal of the American Chemical Society · 2023 · 42 citations

Synthetic Macromolecule, Supramolecular Assembly, Engineering +11

Light-Activated Adhesion and Debonding of Underwater Pressure-Sensitive Adhesives

Yen‐Ming Tseng, Amal Narayanan, Kaushik Mishra et al. · ACS Applied Materials & Interfaces · 2021 · 34 citations

Materials Science, Self-cleaning Surface, Peel Strength +14

Thread Size and Polymer Composition of 3D Printed and Electrospun Wound Dressings Affect Wound Healing Outcomes in an Excisional Wound Rat Model

Nicholas Nun, Megan A. Cruz, Tanmay Jain et al. · Biomacromolecules · 2020 · 32 citations

Tissue Engineering, Engineering, Thread Size +17

Pendant Amines in the Hard or Soft Segments of PCL-Polyurethanes Have Contrasting Effects on the Mechanical and Surface Properties

Chinnapatch Tantisuwanno, Tanmay Jain, Yen‐Ming Tseng et al. · Macromolecules · 2024 · 23 citations

[Ni<sup>III</sup>(OMe)]-mediated reductive activation of CO<sub>2</sub> affording a Ni(κ<sup>1</sup>-OCO) complex

Tzung‐Wen Chiou, Yen‐Ming Tseng, Tsai‐Te Lu et al. · Chemical Science · 2016 · 20 citations · Full text

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