Wen Dai

Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader

Qingwei Yan, Wen Dai, Jingyao Gao et al. · ACS Nano · 2021 · 350 citations

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

Wen Dai, Tengfei Ma, Qingwei Yan et al. · ACS Nano · 2019 · 330 citations

A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods

Wen Dai, Le Lv, Jibao Lu et al. · ACS Nano · 2019 · 257 citations

Constructing a “pea-pod-like” alumina-graphene binary architecture for enhancing thermal conductivity of epoxy composite

Yapeng Chen, Xiao Hou, Meizhen Liao et al. · Chemical Engineering Journal · 2019 · 237 citations

Materials Science, Engineering, Carbon-based Material +7

Whole-Teflon microfluidic chips

Kangning Ren, Wen Dai, Jianhua Zhou et al. · Proceedings of the National Academy of Sciences · 2011 · 213 citations

Teflon Materials, Whole-teflon Microfluidic Chips, Engineering +15