Concepedia

Hyung Jun Lee

HJ

2

Publications

25

Citations

2

H-Index

2011

Active since

Affiliations

Chung-Ang University(Current)

Hyung Jun Lee is an author at Chung-Ang University specializing in fluid mechanics, microfluidics, and electronic packaging.

Top concepts

EngineeringMicrofluidicsFluid DynamicsMultiphase FlowMicrofabricationElectronic PackagingRheologySoft MatterHydromechanicsFluid Properties

Publications per year

2011–2014

2

Publications

2

Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging

Hyuk Rok Gwon, Hyung Jun Lee, Jong‐Min Kim et al. · Journal of Mechanical Science and Technology · 2014 · 14 citations

Chip-scale Package, Engineering, Dynamic Behavior +12

Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging

Seong Hyuk Lee, Hyung Jun Lee, Jong‐Min Kim et al. · MATERIALS TRANSACTIONS · 2011 · 11 citations · Full text

Engineering, Flip Chip Package, Fluid Mechanics +24

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