Soft Microfluidic Assemblies of Sensors, Circuits, and Radios for the Skin

Sheng Xu, Yihui Zhang, Lin Jia, +15

Science

Mechanical BucklingEngineeringMechanical EngineeringSmart SurfaceBiofabrication +17

Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling

Sheng Xu, Zheng Yan, Kyung‐In Jang, +22

Science

A mechanically driven form of Kirigami as a route to 3D mesostructures in micro/nanomembranes

Yihui Zhang, Zheng Yan, Kewang Nan, +18

Proceedings of the National Academy of Sciences

EngineeringSoft MatterMicroscale SystemMicrofluidicsDriven Form +17

Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics

Haoran Fu, Kewang Nan, Wubin Bai, +22

Nature Materials

EngineeringMicromechanicsMicrofabricationMechanical EngineeringApplied Physics +8

Buckling in serpentine microstructures and applications in elastomer-supported ultra-stretchable electronics with high areal coverage

Yihui Zhang, Sheng Xu, Haoran Fu, +5

Soft Matter

EngineeringSevere Plastic DeformationMechanical EngineeringMechanics Of MaterialsHigh Areal Coverage +18

Epidermal photonic devices for quantitative imaging of temperature and thermal transport characteristics of the skin

Li Gao, Yihui Zhang, Viktor Malyarchuk, +13

Nature Communications

PhotonicsEngineeringThermographyBiomedical ImagingQuantitative Imaging +13

Forsythoside A Mitigates Alzheimer's-like Pathology by Inhibiting Ferroptosis-mediated Neuroinflammation via Nrf2/GPX4 Axis Activation

Chunyue Wang, Shanshan Chen, Hangyu Guo, +4

International Journal of Biological Sciences

Mechanical assembly of complex, 3D mesostructures from releasable multilayers of advanced materials

Zheng Yan, Fan Zhang, Fei Liu, +20

Science Advances

Mechanics of ultra-stretchable self-similar serpentine interconnects

Yihui Zhang, Haoran Fu, Yewang Su, +6

Acta Materialia

EngineeringSevere Plastic DeformationMechanical EngineeringSolid MechanicsElectronic Packaging +1

A hierarchical computational model for stretchable interconnects with fractal-inspired designs

Yihui Zhang, Haoran Fu, Sheng Xu, +5

Journal of the Mechanics and Physics of Solids

3D Ic ArchitecturePhysical Design (Electronics)EngineeringAdvanced Packaging (Semiconductors)Flexible Electronics +9