Photonic wire bonding: a novel concept for chip-scale interconnects

N. Lindenmann, G. Balthasar, D. Hillerkuss, +5

Optics Express

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Muhammad Rodlin Billah, Matthias Blaicher, T. Hoose, +10

Optica

Surface plasmon polariton absorption modulator

A. Melikyan, N. Lindenmann, Stefan Walheim, +9

Optics Express

PlasmonicsElectrical EngineeringPhotonicsOptical MaterialsEngineering +10

Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding

N. Lindenmann, Stephan Dottermusch, M. Goedecke, +6

Journal of Lightwave Technology

Photonic DevicePhotonicsOptical InterconnectsEngineeringMultimaterial Fiber +12

Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding

Muhammad Rodlin Billah, T. Hoose, Temitope Onanuga, +10

PhotonicsOptical InterconnectsEngineeringIntegrated PhotonicsDevice Integration +13

Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding

N. Lindenmann, Stephan Dottermusch, T. Hoose, +4

PhotonicsActive AlignmentOptical InterconnectsEngineeringMultimaterial Fiber +12

A Surface Plasmon Polariton Absorption Modulator

A. Melikyan, T. Vallaitis, N. Lindenmann, +3

PlasmonicsPhotonicsPolariton DynamicEngineeringPhysics +6

Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips

T. Hoose, Muhammad Rodlin Billah, Matthias Blaicher, +11

Optical Fiber Communication Conference

EngineeringPhotonic ChipsIntegrated PhotonicsDevice IntegrationIntegrated Circuits +14

A surface plasmon polariton absorption modulator

Juerg Leuthold, W. Freude, C. Koos, +2

Optical MaterialsEngineeringOptical ModulationPolariton DynamicOptical Properties +15

Photonic Waveguide Bonds – A Novel Concept for Chip-to-Chip Interconnects

N. Lindenmann, Ingo Kaiser, G. Balthasar, +5