Tse-Han Pan is an author at Xperi (United States) specializing in three-dimensional integrated circuits, 3d integration, and computer-aided design.
Top concepts
Design3D PrintingEngineeringVlsi Design3D IntegrationMicroelectronicsIntegrated CircuitsComputer EngineeringElectronic PackagingComputer Architecture
Publications per year
2021–2021
1
1
Design Benefits of Hybrid Bonding for 3D Integration
Theodros Nigussie, Tse-Han Pan, S. Lipa et al. · 2021 · 13 citations
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