Tengyuan Zhang

Fabrication of flexible copper-based electronics with high-resolution and high-conductivity on paper via inkjet printing

Tengyuan Zhang, Xiaolong Wang, Tingjie Li et al. · Journal of Materials Chemistry C · 2013 · 112 citations

Natural Sciences, Materials Engineering, Materials Science +15

i3DP, a robust 3D printing approach enabling genetic post-printing surface modification

Xiaolong Wang, Xiaobing Cai, Qiuquan Guo et al. · Chemical Communications · 2013 · 105 citations

Engineering, Materials Engineering, Materials Science +9

Direct Pen Writing of Adhesive Particle-Free Ultrahigh Silver Salt-Loaded Composite Ink for Stretchable Circuits

Mingjun Hu, Xiaobing Cai, Qiuquan Guo et al. · ACS Nano · 2015 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +15

Suppressing Corrosion of Aluminum Foils via Highly Conductive Graphene-like Carbon Coating in High-Performance Lithium-Based Batteries

Xia Li, Sixu Deng, Mohammad Norouzi Banis et al. · ACS Applied Materials & Interfaces · 2019 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +17

Paper with Power: Engraving 2D Materials on 3D Structures for Printed, High‐Performance, Binder‐Free, and All‐Solid‐State Supercapacitors

Tengyuan Zhang, Xia Li, Eaton Asher et al. · Advanced Functional Materials · 2018 · 51 citations

Natural Sciences, Materials Engineering, Materials Science +17