Concepedia

Chia Ling Pai

CL

11

Publications

1.1K

Citations

11

H-Index

2005

Active since

Affiliations

Massachusetts Institute of Technology(Current)

University of Washington

National Taiwan University

Chia Ling Pai is an author at Massachusetts Institute of Technology specializing in engineering, materials science, and mechanical engineering.

Top concepts

Publications per year

2005–2011

11

Publications

11

Morphology of Porous and Wrinkled Fibers of Polystyrene Electrospun from Dimethylformamide

Chia Ling Pai, Mary C. Boyce, Gregory C. Rutledge · Macromolecules · 2009 · 260 citations

, , +13

Mechanical properties of individual electrospun PA 6(3)T fibers and their variation with fiber diameter

Chia Ling Pai, Mary C. Boyce, Gregory C. Rutledge · Polymer · 2011 · 136 citations

, , +6

Spin coating of conjugated polymers for electronic and optoelectronic applications

Chao‐Ching Chang, Chia Ling Pai, Wen‐Chang Chen et al. · Thin Solid Films · 2005 · 128 citations

, , +7

Wrinkled surface topographies of electrospun polymer fibers

Lifeng Wang, Chia Ling Pai, Mary C. Boyce et al. · Applied Physics Letters · 2009 · 112 citations

, , +8

Elastic–plastic behavior of non-woven fibrous mats

Meredith N. Silberstein, Chia Ling Pai, Gregory C. Rutledge et al. · Journal of the Mechanics and Physics of Solids · 2011 · 107 citations

, , +3

Rows per page

1–5 of 11