Statistics
Publications
2
Citations
24
H-Index
2
Active since
2008
Affiliations
Universiti Sains Malaysia(Current)
Ngoc Binh Duong is an author at Universiti Sains Malaysia specializing in electronic packaging, mechanical engineering, and engineering.
Publications per year
2008–2020
2
2
Wettability of Lead-Free Solders on Gold-Plated Copper Substrates
Ngoc Binh Duong, Tadashi Ariga, Luay Bakir Hussain et al. · MATERIALS TRANSACTIONS · 2008 · 13 citations · Full text
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