Concepedia

Karel Rendl

KR

3

Publications

51

Citations

3

H-Index

2014

Active since

Affiliations

University of West Bohemia in Pilsen(Current)

Karel Rendl is an author at University of West Bohemia in Pilsen specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicrostructureMicroelectronicsMaterials EngineeringElectrical EngineeringMechanical EngineeringMechanics Of MaterialsChemistry

Publications per year

2014–2015

3

Publications

3

Influence of reflow soldering profiles on creation of IMC at the interface of SnBi/Cu

Martin Hirman, Karel Rendl, František Steiner et al. · 2014 · 20 citations

Imc Layer, Engineering, Industrial Engineering +19

Effect of multiple reflow cycles on intermetallic compound creation

Václav Wirth, Karel Rendl, František Steiner · 2015 · 17 citations

Materials Engineering, Materials Science, Solder Profile +14

Comparison of the surface properties of power electronic substrates

Karel Hromadka, Jan Řeboun, Karel Rendl et al. · 2015 · 14 citations

Engineering, Copper Layer, Thick Film Copper +20

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