Harold Croop is an author at University of Dayton specializing in hypersonic flow, engineering, and electronic packaging.
Top concepts
EngineeringHeat TransferHypersonic FlowMaterial ScienceSpace EngineeringThermal ManagementThermal EngineeringElectronic PackagingHypersonic PropulsionMaterials Fabrication
Publications per year
2006–2006
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