Statistics
Publications
1
Citations
28
H-Index
1
Active since
2003
Affiliations
Aptiv (United States)(Current)
Shing Yeh is an author at Aptiv (United States) specializing in materials science, semiconductor devices, and semiconductor device materials.
Publications per year
2003–2003
1
1
Recent advances in flip chip wafer bumping using solder paste technology
P. Elenius, L. Leal, J. Ney et al. · 2003 · 28 citations
1–1 of 1