P. Serisky

Statistics

Publications

Citations

155

H-Index

Active since

1988

Affiliations

Poughkeepsie Public Library District(Current)

P. Serisky is an author at Poughkeepsie Public Library District specializing in moisture damage, packaging engineering, and package-level reliability.

Publications per year

1988–2003

Publications

Moisture Induced Package Cracking in Plastic Encapsulated Surface Mount Components During Solder Reflow Process

Rong-Zheng Lin, Edmund Blackshear, P. Serisky · Reliability physics · 1988 · 86 citations

Natural Sciences, Materials Engineering, Materials Science +17

Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process

R. Lin, E. Blackshear, P. Serisky · 2003 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +17

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