Concepedia

Shao-Ping Shen

SS

4

Publications

216

Citations

4

H-Index

2009

Active since

Affiliations

National Chung Hsing University(Current)

ITRI International

Industrial Technology Research Institute

Shao-Ping Shen is an author at National Chung Hsing University specializing in materials science, engineering, and corrosion.

Top concepts

EngineeringMaterial ScienceCorrosionApplied PhysicsSurface ScienceChemical EngineeringElectronic PackagingMaterials EngineeringChemistry3D Printing

Publications per year

2009–2014

4

Publications

4

Microvia filling by copper electroplating using diazine black as a leveler

Wei‐Ping Dow, Chih-Chan Li, Yong-Chih Su et al. · Electrochimica Acta · 2009 · 160 citations

Chemical Engineering, Microvia Filling

Copper seed layer repair using an electroplating process for through silicon via metallization

Shao-Ping Shen, Wei‐Hsiang Chen, Wei‐Ping Dow et al. · Microelectronic Engineering · 2013 · 21 citations

Materials Science, Electrometallurgy, Engineering +2

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Shao-Ping Shen, Wei‐Ping Dow · Journal of The Electrochemical Society · 2014 · 19 citations · Full text

Aluminium Nitride, Engineering, Chemistry +18

Novel Cu plating formula for filling through silicon vias

Shao-Ping Shen, Wei‐Ping Dow, Motonobu Kubo et al. · 2009 · 16 citations

Engineering, Silicon On Insulator, Interconnect (Integrated Circuits) +18

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