Statistics
Publications
3
Citations
93
H-Index
3
Active since
2019
Mark Kuemerle is an author at Broadcom (United States) specializing in chip packaging, chiplet interconnects, and computer engineering.
Publications per year
2019–2020
3
3
Bunch of Wires: An Open Die-to-Die Interface
Shahab Ardalan, Halil Cirit, Ramin Farjad et al. · 2020 · 27 citations
An Open Inter-Chiplet Communication Link: Bunch of Wires (BoW)
Shahab Ardalan, Mark Kuemerle, K. Poulton et al. · IEEE Micro · 2020 · 27 citations
Engineering, Computer Engineering, Electrical Engineering +17
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