J. Siettmann is an author at Intel (United States) specializing in mechanical engineering, instrumentation, and electronic packaging.
Top concepts
NoiseMicroscopyUltrasoundEngineeringWave AnalysisInstrumentationElectronic PackagingComputational ImagingMechanical Engineering
Publications per year
1992–1992
1
1
Acoustic evaluation of electronic plastic packages
J. Siettmann, Rajen Dias, K. Fiebelkorn · 1992 · 11 citations
Engineering, Csam Images, Microscopy +13
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