21:T552,Functional inks enable manufacturing of flexible electronic devices by means of printing technology. Silver nanoparticle (Ag NP) ink is widely used for printing conductive components. A sintering process is required to obtain sufficient conductivity. Thermal sintering is the most commonly used method, but the heat must be carefully applied to avoid damaging low-temperature substrates such as polymer films. In this work, two alternative sintering methods, damp heat sintering and water sintering are systematically investigated for inkjet-printed Ag tracks on polymer substrates. Both methods allow sintering polyvinyl pyrrolidone (PVP) capped Ag NPs at 85°C. In this way, the resistance is significantly reduced to only 1.7 times that of the samples on polyimide sintered in an oven at 250°C. The microstructure of sintered Ag NPs is analyzed. Taking the states of the capping layer under different conditions into account, the explanation of the sintering mechanism of Ag NPs at low temperatures is presented. Overall, both damp heat sintering and water sintering are viable options for achieving high conductivity of printed Ag tracks. They can broaden the range of substrates available for flexible electronic device fabrication while mitigating substrate damage risks. The choice between them depends on the specific application and the substrate used.22:T445,In the field of printed electronics, electronic components such as varactors are of special interest. As ferroelectric materials, Ba_0.6Sr_0.4TiO₃ (BST) and poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE)) are promising compounds to be used in functional inks for the fabrication of fully inkjet-printed dielectric layers. In BST/P(VDF-TrFE) composite inks, the influence of the particle and crystallite size is investigated by using different grinding media sizes and thermal treatments at varying temperatures. It was found that with an increasing particle and crystallite size, both the relative permittivity and tunability increase as well. However, the thermal treatment which impacts both the particle and crystallite size has a greater effect on the dielectric properties. An additional approach is the reduction in the dielectric layer thickness, which has a significant effect on the maximal tunability. Here, with a thickness of 0.9 µm, a tunability of 29.6% could be achieved in an external electric field of 34 V µm^-1.

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