Qiong Fan

Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

Hui‐Wang Cui, Dongsheng Li, Qiong Fan et al. · International Journal of Adhesion and Adhesives · 2013 · 47 citations

Materials Science, Conductive Adhesives, Boron Nitride +10

High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package

Hui‐Wang Cui, Agnieszka Kowalczyk, Dongsheng Li et al. · International Journal of Adhesion and Adhesives · 2013 · 42 citations

Materials Science, Electronic Package, Electrical Engineering +14

Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro‐silver flakes and nano‐silver spheres for electronic packaging

Hui‐Wang Cui, Qiong Fan, Dong‐Sheng Li · Polymer International · 2013 · 36 citations

Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package

Hui‐Wang Cui, Qiong Fan, Dongsheng Li · International Journal of Adhesion and Adhesives · 2013 · 31 citations

Materials Science, Electronic Package, Conductive Adhesives +8

Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives

Hui‐Wang Cui, Dongsheng Li, Qiong Fan · Electronic Materials Letters · 2013 · 24 citations

Materials Science, Electroactive Material, Functional Epoxy +11