Rajendra K. Aithal

Electroless copper deposition on silicon with titanium seed layer

Rajendra K. Aithal, S. Yenamandra, R.A. Gunasekaran et al. · Materials Chemistry and Physics · 2006 · 37 citations

Materials Science, Electroless Copper Deposition, Chemical Vapor Deposition +1

Nano-assembly of manganese peroxidase and lignin peroxidase from P. chrysosporium for biocatalysis in aqueous and non-aqueous media

Devendra S. Patel, Rajendra K. Aithal, Gopal Krishna et al. · Colloids and Surfaces B Biointerfaces · 2005 · 19 citations

Chemical Engineering, Catalytic Application, Engineering +5

Molecular Rectifying Diodes Based on an Aluminum/4′-Hydroxy-4-biphenyl Carboxylic Acid/p⁺-Silicon Junction

Sridevi Bala, Rajendra K. Aithal, Pedro A. Derosa et al. · The Journal of Physical Chemistry C · 2010 · 13 citations

Chemical Engineering, Electronic Devices, Engineering +12

Fabrication and characterization of an indium tin oxide-octadecanethiol-aluminum junction for molecular electronics

Shailender Kolipaka, Rajendra K. Aithal, Debasish Kuila · Applied Physics Letters · 2006 · 12 citations

Aluminium Nitride, Engineering, Nanostructured Surface +20