Statistics
Publications
16
Citations
541
H-Index
16
Active since
2006
Shih‐Wei Hung is an author at National Tsing Hua University specializing in materials science, natural sciences, and materials engineering.
Publications per year
2006–2023
16
16
Weaker bonding can give larger thermal conductance at highly mismatched interfaces
Bin Xu, Shiqian Hu, Shih‐Wei Hung et al. · Science Advances · 2021 · 92 citations · Full text
Multislip-enabled morphing of all-inorganic perovskites
Xiaocui Li, You Meng, Wanpeng Li et al. · Nature Materials · 2023 · 55 citations
Natural Sciences, Materials Engineering, Materials Science +12
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