16
Publications
520
Citations
16
H-Index
2006
Active since
Shih‐Wei Hung is an author at National Tsing Hua University specializing in engineering, applied physics, and materials science.
Top concepts
EngineeringApplied PhysicsMaterial ScienceNanomaterialsMolecular DynamicsNanotechnologyBiophysicsSurface SciencePhysicsSelf-assembly
Publications per year
2006–2023
16
16
Weaker bonding can give larger thermal conductance at highly mismatched interfaces
Bin Xu, Shiqian Hu, Shih‐Wei Hung et al. · Science Advances · 2021 · 83 citations · Full text
Multislip-enabled morphing of all-inorganic perovskites
Xiaocui Li, You Meng, Wanpeng Li et al. · Nature Materials · 2023 · 50 citations
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