Concepedia

Chun Wai Kum

CW

6

Publications

346

Citations

6

H-Index

2013

Active since

Affiliations

Singapore Institute of Manufacturing Technology(Current)

Dalian University of Technology

Nanyang Technological University

Chun Wai Kum is an author at Singapore Institute of Manufacturing Technology specializing in engineering, materials science, and mechanical engineering.

Top concepts

Publications per year

2013–2020

6

Publications

6

Novel rotating-vibrating magnetic abrasive polishing method for double-layered internal surface finishing

Jiang Guo, Ka Hing Au, Chen‐Nan Sun et al. · Journal of Materials Processing Technology · 2018 · 139 citations

, , +9

Prediction and compensation of material removal for abrasive flow machining of additively manufactured metal components

Chun Wai Kum, Chih-Hua Wu, Stephen Wan et al. · Journal of Materials Processing Technology · 2020 · 61 citations

, , +10

Internal Surface Quality Enhancement of Selective Laser Melted Inconel 718 by Abrasive Flow Machining

Jiang Guo, Chuanping Song, Youzhi Fu et al. · Journal of Manufacturing Science and Engineering · 2020 · 54 citations

, , +16

A novel media properties-based material removal rate model for magnetic field-assisted finishing

Chun Wai Kum, Takashi Satō, Jiang Guo et al. · International Journal of Mechanical Sciences · 2018 · 41 citations

, , +6

New vibration-assisted magnetic abrasive polishing (VAMAP) method for microstructured surface finishing

Jiang Guo, Chun Wai Kum, Ka Hing Au et al. · Optics Express · 2016 · 34 citations · Full text

, , +14

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