27
Publications
1.4K
Citations
21
H-Index
2008
Active since
Jun-Ping Du is an author at The University of Osaka specializing in materials science, engineering, and applied physics.
Top concepts
EngineeringMaterial ScienceMicrostructureApplied PhysicsSolid MechanicsMechanics Of MaterialsPhysicsMaterials EngineeringMechanical EngineeringChemistry
Publications per year
2008–2024
27
27
Radiation-Induced Helium Nanobubbles Enhance Ductility in Submicron-Sized Single-Crystalline Copper
Ming‐Shuai Ding, Jun-Ping Du, Liang Wan et al. · Nano Letters · 2016 · 132 citations
Nobuhiro Tsuji, Shigenobu Ogata, Haruyuki Inui et al. · Scripta Materialia · 2020 · 84 citations
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