Statistics
Publications
2
Citations
22
H-Index
2
Active since
2012
Affiliations
University of Niigata Prefecture(Current)
Shin Teraki is an author at University of Niigata Prefecture specializing in chip packaging, electronic materials, and materials engineering.
Publications per year
2012–2017
2
2
Effect of NCF design for the assembly of Flip Chip and reliability
Satomi Kawamoto, Masaki Yoshida, Shin Teraki et al. · 2012 · 12 citations
High Performance Insulating Adhesive Film for High-Frequency Applications
Junya Sato, Shin Teraki, Masaki Yoshida et al. · 2017 · 10 citations
Engineering, Electrical Engineering, Materials Engineering +17
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