Hung-Che Liu

Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films

Po-Fan Lin, Dinh-Phuc Tran, Hung-Che Liu et al. · Materials · 2022 · 24 citations · Full text

Cu Films, Engineering, Integrated Circuits +23

Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils

Chuan-Yu Fang, Dinh-Phuc Tran, Hung-Che Liu et al. · Journal of The Electrochemical Society · 2022 · 23 citations

Engineering, Mechanical Engineering, Metal Processing +22

Epitaxial Growth of (111) Nanotwinned Ag on (111) Nanotwinned Cu Films for Low-Temperature Cu–Cu Bonding

H.-C. Tseng, Hung-Che Liu, Min-Hsun Yu et al. · Crystal Growth & Design · 2023 · 17 citations

Cu Films, Engineering, Metallic Nanomaterials +18

Evolution of interfacial voids in Cu-to-Cu joints

Hung-Che Liu, Shih‐Chi Yang, Jia-Juen Ong et al. · Materials Characterization · 2022 · 15 citations

Materials Science, Electromigration Technique, Engineering +7

Mechanical strengthening of nanotwinned Cu films with Ag solid solution

Kang-Ping Lee, Dinh-Phuc Tran, Fu-Chian Chen et al. · Materials Letters · 2022 · 13 citations

Materials Science, Materials Engineering, Engineering +9