Vithyacharan Retnasamy

FDTD analysis of structured metallic nanohole films for LSPR-based biosensor

Fairus Atida Said, P. Susthitha Menon, T. Kalaivani et al. · 2015 · 23 citations

Engineering, Biomedical Engineering, Metallic Nanomaterials +19

Interaction of Surface Roughness and Copper Ball Adhesion Using Shearing Simulation

Vithyacharan Retnasamy, Zaliman Sauli, Ahmad Husni Mohd Shapri et al. · 2012 · 13 citations

Engineering, Mechanical Engineering, Nanotribology +18

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

Zaliman Sauli, Vithyacharan Retnasamy, Steven Taniselass et al. · Advanced materials research · 2012 · 11 citations

Materials Science, Electrical Engineering, Engineering +15

Shear Stress Analysis Study Using Surface Morphology Correlation with Aluminium Ball Adhesion

Vithyacharan Retnasamy, Zaliman Sauli, Mohd H. A. Aziz et al. · 2012 · 11 citations

Engineering, Mechanical Engineering, Residual Stress +18

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

Boon Kar Yap, Noor Azrina Talik, Zaliman Sauli et al. · Microelectronics International · 2013 · 11 citations

Engineering, Solder Ball, Flip Chip Package +17