S. Ohizumi is an author at Nitto (Japan) specializing in electronic packaging, mechanics of materials, and engineering.
Top concepts
EngineeringSolid MechanicsMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsFood PackagingMicrostructureMicrofabricationIndustrial Design
Publications per year
1992–2002
2
2
X-ray analysis of the package cracking during reflow soldering
Masahide Harada, S. Tanigawa, S. Ohizumi et al. · 1992 · 17 citations
Rows per page
1–2 of 2