Statistics
Publications
2
Citations
31
H-Index
2
Active since
2023
Affiliations
Sebastian Schermer is an author at Chemnitz University of Technology specializing in interface engineering, integrated circuit design, and surface engineering.
Publications per year
2023–2023
2
2
Process and Design Challenges for Hybrid Bonding
Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · ECS Transactions · 2023 · 17 citations · Full text
Engineering, Electrical Engineering, Materials Engineering +16
Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding
Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · 2023 · 14 citations
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