Xavier F. Brun

Analysis of stresses and breakage of crystalline silicon wafers during handling and transport

Xavier F. Brun, Shreyes N. Melkote · Solar Energy Materials and Solar Cells · 2009 · 140 citations

Wafer Scale Processing, Engineering, Advanced Packaging (Semiconductors) +11

Modeling and Prediction of the Flow, Pressure, and Holding Force Generated by a Bernoulli Handling Device

Xavier F. Brun, Shreyes N. Melkote · Journal of Manufacturing Science and Engineering · 2009 · 53 citations

Engineering, Flow Control, Fluid Mechanics +23

A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly

Dingying Xu, Hsin‐Wei Wang, Jigneshkumar P. Patel et al. · 2020 · 25 citations

Engineering, Temporary Glass Carrier, Mechanical Engineering +17

Characterization of 300 mm Low Temperature SiCN PVD Films for Hybrid Bonding application

Xavier F. Brun, Md. Mahmudul Hasan, Yi Yang et al. · 2023 · 21 citations

Engineering, Thin Film Process Technology, Photovoltaics +20

Evaluation of Handling Stresses Applied to EFG Silicon Wafer using a Bernoulli Gripper

Xavier F. Brun, Shreyes N. Melkote · 2006 · 18 citations

Polycrystalline Silicon Wafers, Engineering, Mechanical Engineering +18