Statistics
Publications
1
Citations
21
H-Index
1
Active since
2017
Lewis Kang is an author specializing in wire bonding, semiconductor devices, and system-in-package.
Publications per year
2017–2017
1
1
FOWLP technology as wafer level system in packaging (SiP) solution
Leo Lee, Lewis Kang, Yong Tae Kwon et al. · 2017 · 21 citations
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