Holger Worrack

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Active since

2008

Affiliations

Holger Worrack is an author at Technische Universität Berlin specializing in materials engineering, microstructure analysis, and strength of materials.

Publications per year

2008–2009

Publications

How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments

Wolfgang H. Müller, Holger Worrack, Jens Sterthaus et al. · Microsystem Technologies · 2008 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16

Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods

T. Hannach, Holger Worrack, Wolfgang H. Müller et al. · Archive of Applied Mechanics · 2009 · 15 citations

Engineering, Electrical Engineering, Materials Engineering +16

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