6
Publications
112
Citations
6
H-Index
2008
Active since
Baojun Qiu is an author at China Electronic Product Reliability and Environmental Test Institute specializing in microelectronics, electronic packaging, and mechanical engineering.
Top concepts
EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMechanical EngineeringSolid MechanicsMaterial ScienceThermal EngineeringMechanics Of Materials3D Printing
Publications per year
2008–2023
6
6
Survey on Fatigue Life Prediction of BGA Solder Joints
Baojun Qiu, Jingang Xiong, Han Wang et al. · Electronics · 2022 · 43 citations · Full text
Engineering, Mechanical Engineering, Reliability Engineering +17
Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock
Shuai Zhou, Zhenpei Lin, Baojun Qiu et al. · Electronics · 2022 · 21 citations · Full text
Survey of Reliability Research on 3D Packaged Memory
Shuai Zhou, Kaixue Ma, Yugong Wu et al. · Electronics · 2023 · 12 citations · Full text
A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images
Daohua Zhan, Jian Lin, Xiuding Yang et al. · Micromachines · 2023 · 11 citations · Full text
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