Niwat Mookam

Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

Niwat Mookam, Kannachai Kanlayasiri · Journal of Material Science and Technology · 2012 · 68 citations

Materials Science, Materials Engineering, Cu Substrate +11

Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate

Niwat Mookam, Kannachai Kanlayasiri · Journal of Alloys and Compounds · 2011 · 44 citations

Materials Science, Materials Engineering, Cu Substrate +7

Effects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering

Niwat Mookam, Phacharaphon Tunthawiroon, Kannachai Kanlayasiri · IOP Conference Series Materials Science and Engineering · 2018 · 22 citations · Full text

Materials Engineering, Materials Science, Reflow Soldering +15

Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders

Kannachai Kanlayasiri, Niwat Mookam · Transactions of Nonferrous Metals Society of China · 2022 · 16 citations · Full text

Materials Engineering, Materials Science, Sn–xcu Lead-free Solders +13

Effects of Graphite and Boron Carbide Powders Mixed into Dielectric Fluid on Electrical Discharge Machining of SKD 11 Tool Steel

Niwat Mookam, Piyawan Sunasuan, Tavee Madsa et al. · Arabian Journal for Science and Engineering · 2021 · 13 citations

Electrical Engineering, Dielectric Fluid, Engineering +8