Riina Ritasalo

Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)

Joonsoo Jeong, Farah Laiwalla, Ji-Hun Lee et al. · Advanced Functional Materials · 2018 · 91 citations

Engineering, Radio Frequency, Biomedical Engineering +20

The Microstructural Effects on the Mechanical and ThermalProperties of Pulsed Electric Current Sintered Cu-Al2O3 Composites

Riina Ritasalo, X.W. Liua, Outi Söderberg et al. · Procedia Engineering · 2011 · 35 citations · Full text

Materials Science, Materials Engineering, Ceramic Matrix Composite +12

Toward 3D Thin-Film Batteries: Optimal Current-Collector Design and Scalable Fabrication of TiO₂ Thin-Film Electrodes

Sébastien Moitzheim, Joan Elisabeth Balder, Riina Ritasalo et al. · ACS Applied Energy Materials · 2019 · 34 citations · Full text

Engineering, Thin-film Batteries, Thin Film Process Technology +25

Spark plasma sintering of submicron-sized Cu-powder—Influence of processing parameters and powder oxidization on microstructure and mechanical properties

Riina Ritasalo, M. Erkin Cura, X.W. Liu et al. · Materials Science and Engineering A · 2010 · 31 citations

Materials Science, Powder Processing, Sintering +9

Microstructural and mechanical characteristics of Cu–Cu2O composites compacted with pulsed electric current sintering and hot isostatic pressing

Riina Ritasalo, M. Erkin Cura, X.W. Liu et al. · Composites Part A Applied Science and Manufacturing · 2012 · 25 citations

Materials Science, Sintering, Engineering +7