Concepedia
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Publications
1
Citations
43
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Active since
2022
Govindrajan Murali is an author specializing in chip packaging, computational heat transfer, and thermal-aware design.
Publications per year
2022–2022
CFD Approach for Thermal Management to Enhance the Reliability of IC Chips
Anant Sidhappa Kurhade, Govindrajan Murali, Venkateswara Rao T · International Journal of Engineering Trends and Technology · 2022 · 43 citations
Engineering, Computational Engineering, Mechanical Engineering +16
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