A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors

C. Auth, C. Allen, A. Blattner, +44

Low-power Cmos TechnologyEngineeringVlsi DesignTri-gate TransistorsIntegrated Circuits +17

Nanometer scale multilayered hard coatings

P. Yashar, William D. Sproul

Vacuum

Materials ScienceEngineeringSurface ScienceNanometer ScaleMulti-functional Coating +2

Asymmetric Magnetization Reversal in Exchange-Biased Hysteresis Loops

M. R. Fitzsimmons, P. Yashar, Chris Leighton, +4

Physical Review Letters

Stabilization of Cubic AlN in Epitaxial AlN/TiN Superlattices

Anita Madan, I. W. Kim, Shangcong Cheng, +3

Physical Review Letters

Materials EngineeringMaterials ScienceHigh-pressure Rocksalt StructureMineral PhysicEngineering +12

Two-Stage Magnetization Reversal in Exchange Biased Bilayers

Chris Leighton, M. R. Fitzsimmons, P. Yashar, +5

Physical Review Letters

EngineeringMagnetic ResonanceSpintronic MaterialMagnetic MaterialsMagnetoresistance +17

Structure and mechanical properties of polycrystalline CrN/TiN superlattices

P. Yashar, S. A. Barnett, J. Rechner, +1

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Magnetic PropertiesEngineeringMechanical EngineeringMaterial SystemStructural Materials +15

Low-k interconnect stack with multi-layer air gap and tri-metal-insulator-metal capacitors for 14nm high volume manufacturing

K. Fischer, M. Agostinelli, C. Allen, +34

EngineeringVlsi DesignLogic ProductComputer ArchitectureInterconnect (Integrated Circuits) +17

Stabilization of cubic CrN0.6 in CrN0.6/TiN superlattices

P. Yashar, Xiaoyu Chu, S. A. Barnett, +4

Applied Physics Letters

Materials ScienceMaterials EngineeringMaterial AnalysisEngineeringHigh-tc Superconductivity +12

High-rate reactive d.c. magnetron sputtering of ZrOx coatings

Ming‐Show Wong, W. J. Chia, P. Yashar, +3

Surface and Coatings Technology

Materials EngineeringMaterials ScienceThermal Spray CoatingZrox CoatingsEngineering +4

Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing

D. Ingerly, Ankur Agrawal, Ricardo Ascázubi, +34

EngineeringVlsi DesignComputer ArchitectureMetal-insulator-metal CapacitorsInterconnect (Integrated Circuits) +17