Michal Lodzinski

Si∕SiC Heterojunctions Fabricated by Direct Wafer Bonding

Michael R. Jennings, Amador Pérez‐Tomás, Owen James Guy et al. · Electrochemical and Solid-State Letters · 2008 · 34 citations

Materials Science, Semiconductors, Electrical Engineering +15

Investigation of the 4H–SiC surface

Owen James Guy, Michal Lodzinski, Kar Seng Teng et al. · Applied Surface Science · 2008 · 31 citations

Materials Science, Materials Engineering, Engineering +5

Si/SiC bonded wafer: A route to carbon free SiO2 on SiC

Amador Pérez‐Tomás, Michal Lodzinski, Owen James Guy et al. · Applied Physics Letters · 2009 · 29 citations · Full text

Engineering, Thermal Oxidation, Integrated Circuits +17

Silicon carbide Schottky diodes and MOSFETs: Solutions to performance problems

Owen James Guy, Michal Lodzinski, A. Castaing et al. · 2008 · 16 citations

Sic Diode, Semiconductor Technology, Electrical Engineering +11

Ellipsometric and MEIS Studies of 4H-SiC/Si/SiO<sub>2</sub> and 4H-SiC/SiO<sub>2</sub> Interfaces for MOS Devices

Owen James Guy, Tim Jenkins, Michal Lodzinski et al. · Materials science forum · 2007 · 15 citations

Semiconductors, Materials Science, Electrical Engineering +14