Concepedia
1
Publications
14
Citations
H-Index
2024
Active since
Affiliations
Micron (Singapore)(Current)
Yung-Sheng Zou is an author at Micron (Singapore) specializing in engineering, electronic packaging, and mechanical engineering.
Top concepts
EngineeringMaterial ScienceElectronic PackagingMechanical Engineering
Publications per year
2024–2024
Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application
Vance Liu, Yung-Sheng Zou, Yiyu Chen et al. · Materials Science in Semiconductor Processing · 2024 · 14 citations
Materials Science, Handheld Application, Engineering +4
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