Wei‐Ting Yeh

Glass Stability Changes the Nature of Yielding under Oscillatory Shear

Wei‐Ting Yeh, Misaki Ozawa, Kunimasa Miyazaki et al. · Physical Review Letters · 2020 · 108 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Tung‐Han Chuang, H.J. Lin, Cheng‐Hao Chuang et al. · Journal of Electronic Materials · 2014 · 31 citations

Natural Sciences, Materials Engineering, Materials Science +17

A Tiling-Scheme Viterbi Decoder in Software Defined Radio for GPUs

Chih-Sheng Lin, Wei‐Lun Liu, Wei‐Ting Yeh et al. · 2011 · 25 citations

Computing, Computer Engineering, Computer Science +17

Improvement of bonding strength of a (Pb,Sn)Te–Cu contact manufactured in a low temperature SLID-bonding process

Tung‐Han Chuang, Wei‐Ting Yeh, Chien-Hsun Chuang et al. · Journal of Alloys and Compounds · 2014 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +10

Preparation and studies on properties of porous epoxy composites containing microscale hollow epoxy spheres

Chao‐Chen Hsu, Kung‐Chin Chang, Tsao‐Cheng Huang et al. · Microporous and Mesoporous Materials · 2014 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +12