Bui Thanh Son

Improvements in thermal, mechanical, and dielectric properties of epoxy resin by chemical modification with a novel amino-terminated liquid-crystalline copoly(ester amide)

Le Hoang Sinh, Bui Thanh Son, Nguyen Ngoc Trung et al. · Reactive and Functional Polymers · 2012 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +16

Curing behavior, thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent

Le Hoang Sinh, Nguyen Ngoc Trung, Bui Thanh Son et al. · Polymer Engineering and Science · 2013 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermal, dielectric, and rheological properties of aluminum nitride/liquid crystalline copoly(ester amide) composite for the application of thermal interface materials

Le Hoang Sinh, Jeong‐Mi Hong, Bui Thanh Son et al. · Polymer Composites · 2012 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of acrylic copolymer dispersants bearing epoxy groups on rheological and dielectric properties of carbon black‐filled epoxy system

Bui Thanh Son, Yoonbong Kook, Eun Sung Lee et al. · Journal of Applied Polymer Science · 2011 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

Preparation and characterization of silicone resin nanocomposite containing CdSe/ZnS quantum dots

Nguyen Ngoc Trung, Quynh‐Phuong Luu, Bui Thanh Son et al. · Polymer Composites · 2012 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +15