Concepedia

Hoe Chul Kim

HC

17

Publications

452

Citations

14

H-Index

2013

Active since

Affiliations

Seoul National University(Current)

Chung-Ang University

Kumoh National Institute of Technology

Samsung (South Korea)

Soongsil University

Hoe Chul Kim is an author at Seoul National University specializing in materials science, engineering, and chemical engineering.

Top concepts

EngineeringElectrochemistryMaterial ScienceChemical EngineeringChemistrySurface ScienceCorrosionMaterials EngineeringApplied PhysicsMicroelectronics

Publications per year

2013–2018

17

Publications

17

Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums

Myung Jun Kim, Youngran Seo, Hoe Chul Kim et al. · Electrochimica Acta · 2015 · 61 citations

Choline-based Leveler, Civil Engineering, Galvanostatic Bottom-up Filling +1

Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling

Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim et al. · Journal of The Electrochemical Society · 2013 · 54 citations

Materials Engineering, Materials Science, Chemical Engineering +13

Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor

Myung Jun Kim, Hoe Chul Kim, Seunghoe Choe et al. · Journal of The Electrochemical Society · 2013 · 47 citations

Engineering, Chemical Deposition, Silicon On Insulator +18

The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling

Myung Jun Kim, Hoe Chul Kim, Jae Jeong Kim · Journal of The Electrochemical Society · 2016 · 37 citations

Cu Electrodeposition, Engineering, Electrode-electrolyte Interface +18

Communication—Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance

Myung Jun Kim, Youngran Seo, Jung Hwan Oh et al. · Journal of The Electrochemical Society · 2016 · 32 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Rows per page

1–5 of 17